High-speed 3D processing of high-hardness brittle materials! Ultrasonic processing compatible with new materials.
Our company specializes in high-aspect-ratio deep hole processing (blind and through holes) and grinding, as well as machining (2D to 3D) of high-hardness brittle materials such as ceramics, glass, and cemented carbide using ultrasonic rotary processing machines. We use water as the cutting fluid, which is environmentally friendly. Additionally, the low contact pressure and low heat generation protect both the workpiece and the tool. 【Features】 - Drilling (minimum diameter Φ0.3mm), grinding (flat, outer circumference, shapes), and milling (3D shape processing, pocket processing, groove processing) are possible. - The use of diamond tools allows for the processing of high-hardness materials. - Since only vertical vibrations are applied, it is less likely to cause cracks in the horizontal direction. - 5-face/5-axis machining is also possible. *For more details, please download the PDF or feel free to contact us.
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【Processing Examples】 ■Ceramics ・Alumina ・Silicon carbide, etc. ■Glass ・Quartz glass ・Alkali-lime-silica glass, etc. ■Hard metals ・Cemented carbide ・Hardened steel > HRC53-54 ■Composites ・Carbon fiber ・Inorganic fiber ■Silicon ■Gemstones/rocks ■Graphite ■Mother of pearl *For more details, please download the PDF or feel free to contact us.
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Our company has been developing its business by providing molds and precision parts primarily for semiconductors, based on the field of ultra-precision machining. As a reliable partner in manufacturing with solid technology, we respond to increasingly sophisticated needs. Please feel free to contact us if you have any requests.