Fully Automatic Defect Inspection Device for MEMS 'IR-MEMS100'

Detecting hard-to-find defects using processing to make low-contrast images easier to see.

The "IR-MEMS100" is a fully automated MEMS defect inspection device that automatically transports bonded wafers using robots, captures images of the internal state of the wafers with a specialized infrared optical system, and detects various defects using a defect detection algorithm. Images are captured with a high-sensitivity infrared camera set in an infrared microscope, and a proprietary defect detection software identifies hard-to-see defect areas. 【Features】 ■ Captures images with a high-sensitivity infrared camera set in an infrared microscope and detects hard-to-see defect areas using proprietary defect detection software. ■ Uses processing (effect processing) to enhance low-contrast images, making it easier to detect hard-to-find defect areas. ■ Compatible wafer sizes are 4 inches, 6 inches, and 8 inches. ■ Defect detection capability is approximately 10μm. ■ Inspection time is 30 minutes per wafer. *For more details, please refer to the PDF document or feel free to contact us.

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