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  1. Home
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  3. Manufacturing and processing machinery
  4. Mounting Machine
  5. Reflow Equipment
  6. Substrate warpage prevention system for thin printed circuit board assembly

Substrate warpage prevention system for thin printed circuit board assembly

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LPS

last updated:May 08, 2020

ルックス電子
ルックス電子
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Since it is pallet transport, it can reduce substrate warping. It can be used on the back side with a flexible pin.

Supports the production of thin substrates. Adapts to various substrate sizes with flexible pins. Ideal for computers and mobile devices.

    Reflow Equipment
LPS(全体).png

Substrate warpage prevention system for thin printed circuit board assembly

LPS(全体).png
LPS(全体).png

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basic information

During reflow of the implemented board, issues with mounting due to warping can be reduced. The placement of backup pins is flexible, and the mounted surface can be supported.

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Please contact us for details

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Applications/Examples of results

In operation on our own production line. Computers, mobile devices, etc.

Detailed information

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ルックス電子

ルックス電子

Electronic Components and Semiconductors

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Looks Electronics Co., Ltd. is a company primarily engaged in various types of circuit board assembly, board assembly, and the development and manufacturing of FA equipment. With its self-insertion division at its core, skilled employees with experience and know-how in handling a wide variety of printed circuit board assembly are dedicated to manufacturing.

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