Cost reduction examples in transportation, packaging, and logistics: In-process trays for circuit boards.
Many achievements in the Tohoku region! Achieving prevention of lateral displacement during transportation! We will introduce examples of cushioning design.
We would like to introduce a case study on the cushioning design of in-process trays for circuit boards. In this case, we received product data from the customer and designed the tray to fit the product shape, achieving prevention of lateral displacement during transport. Additionally, since it serves as the base for electronic components, we have incorporated reliefs on the surface to ensure that it does not come into contact with packaging materials, which is also a key point. 【Case Overview】 ■ By Application: Cushioning/Protection/Storage/Process ■ By Industry: Electronics/Precision Equipment/Semiconductors ■ By Material Function: Logistics Efficiency ■ Classification List by Packaging Name: Precision Equipment/Working Machines/Tools ■ By Packaging Material: Foam Materials/Cardboard ■ By Purpose: To Protect Products *For more details, please refer to the PDF document or feel free to contact us.
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Whether it is [one-way] or [commuting], whether cushioning is necessary, and the effects of static electricity... the optimal materials vary depending on the contents. We will propose improvements to the packaging format for the 2024 issue. Tohoku Ueno Co., Ltd. will utilize the many packaging examples we have cultivated so far and various new materials developed in recent years to solve environmental issues, offering the best combinations. We will consider all aspects, including cost, material selection, processing methods, and environmental factors, to meet our customers' needs. We will conduct drop tests using the drop tester from Ransomont, analyze the shock waveforms with test partners, and propose optimal cushioning packaging designs.