Cost reduction case studies in transportation, packaging, and logistics: Conductive partition plates for automotive parts.
Many achievements in the Tohoku region! The strict dimensions of both ends are designed as a U-shape integrated with the bottom plate! We will introduce examples of cost reduction in transportation, packaging, and logistics.
We would like to introduce a proposal case for conductive partition boards used in automotive parts. The packaging material is intended for transporting industrial products, and when we received a request from the customer, there were specifications for a designated box and a desired quantity (30 pieces). In our proposal, we made it possible to package the desired quantity in one layer (3×10), and for the strict dimensions at both ends, we designed it in a U-shape integrated with the bottom plate. Additionally, since the products have protrusions such as claws, there was initially a discussion about whether to orient those parts upwards. However, due to the desired quantity, it was difficult to package in the designated box considering dimensions and other factors. After evaluating the desired specifications and the actual packaging results, it was confirmed that vertical placement posed no issues, allowing us to reproduce the customer's request. *For more details, please refer to the PDF document or feel free to contact us.*
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【Case Overview】 ■ By Use: Transport Boxes / Carts and Others ■ By Industry: Electronics / Precision Equipment / Semiconductors ■ By Material Function: Logistics Efficiency / Conductivity / Static Prevention ■ Classification List by Packaging Name: Automotive Parts ■ By Packaging Material: Plastic Cardboard Types ■ By Purpose: To transport products "efficiently" *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Whether it is [one-way] or [commuting], whether cushioning is necessary, and the effects of static electricity... the optimal materials vary depending on the contents. We will propose improvements to the packaging format for the 2024 issue. Tohoku Ueno Co., Ltd. will utilize the many packaging examples we have cultivated so far and various new materials developed in recent years to solve environmental issues, offering the best combinations. We will consider all aspects, including cost, material selection, processing methods, and environmental factors, to meet our customers' needs. We will conduct drop tests using the drop tester from Ransomont, analyze the shock waveforms with test partners, and propose optimal cushioning packaging designs.