Achieving weight reduction! The fin shape can be in three patterns: curl, straight, and separate.
"Aurora Fin" is ultra-fine fin processing. It significantly improves the thermal resistance value per unit volume. It achieves weight reduction with thin fin thickness and thin base thickness. It is suitable for liquid cooling of CPUs, as well as cooling for projectors using laser semiconductors and liquid cooling of power devices. 【VA・VE Effects】 ■ Ultra-fine fin processing ■ Significant improvement in thermal resistance value per unit volume ■ Weight reduction achieved with thin fin thickness and thin base thickness *For more details, please refer to the PDF document or feel free to contact us.
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【Processing Specifications】 ■ Base thickness from 0.3mm, base fins are integrated ■ Fin pitch from 0.2mm, fin height from 1.0mm to 30.0mm ■ Fin shapes can be in three patterns: curled, straight, and separated *For more details, please refer to the PDF document or feel free to contact us.
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【Adaptation Parts】 ■ Liquid cooling for CPU ■ Cooling for projectors using laser semiconductors ■ Liquid cooling for power devices ■ Cooling for the electronic circuit board of high-performance image measurement devices ■ Cooling around aircraft engines ■ Forced air cooling for semiconductors *For more details, please refer to the PDF document or feel free to contact us.
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Nakamura Manufacturing Co., Ltd. has consistently produced metal parts through a uniquely developed press processing process since its establishment. To date, we have obtained 17 stamping series that surpass plastic processing technology and numerous method patents. By anticipating the needs of the times, continuously advancing development, and pursuing originality with technology and quality, we aim to create world-first products and supply products that customers desire worldwide, striving to be a super supplier of high-precision products by providing methods and products that go beyond traditional press methods. Nakamura Manufacturing Co., Ltd. aims for the harmony of people, the environment, and technology.