It can further reduce the implementation area compared to the COB method, enabling miniaturization on the PCB!
We would like to introduce the FCB process technology of Niigata Seimitsu Co., Ltd. The FCB process can accommodate a variety of mounting methods and various substrates. Additionally, we can comprehensively handle other processes related to the FCB process, such as substrate cleaning, dicing, and pickup, all in-house. 【Features】 ■ Formation of bumps on the electrode part of semiconductor chips (ICs) ■ Direct mounting on electrodes on printed circuit boards (PCBs) ■ A method of connecting by applying heat ■ Can achieve an even smaller mounting area than COB methods, enabling miniaturization on PCBs ■ Can also be combined with SMT for module miniaturization *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Implementation Methods - Soldering method, thermal compression bonding method, ACF method, NCF method, ACP method, NCP method ■Types of Substrates - Glass epoxy substrate, ceramic substrate, flexible substrate *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Niigata Seimitsu Co., Ltd. primarily develops SMS business and is engaged in the overall development design, manufacturing, and maintenance of electronic devices and more. We possess various implementation technologies, development/design technologies, and evaluation/analysis technologies, so please feel free to consult us if you have any requests.