We handle all mixed implementation that combines multiple processes in-house! We also deal with a wide range of processes related to mixed implementation!
We would like to introduce the mixed assembly technology of Niigata Seimitsu Co., Ltd. In mixed assembly, we can handle high-density and closely adjacent mixed assembly by combining multiple processes such as "SMT + COB," "FCB + solder ball assembly," and "SMT + FCB + solder ball assembly" all in-house. Additionally, we offer a wide range of other processes related to mixed assembly, including cleaning, dicing, pickup, and embossed stamping. 【Features】 ■ All mixed assembly processes that combine multiple steps can be handled in-house. ■ A wide range of processes related to mixed assembly can also be accommodated. *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■SMT ・Chip size: 0.4×0.2mm (0402)～ ・Ball pitch: 0.3mm (WLCSP)～ ■COB ・Pad pitch: 0.07mm～ ■FCB ・Pad pitch: 0.05mm～ ■Solder ball mounting ・Ball size: φ0.08mm～ *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Niigata Seimitsu Co., Ltd. primarily develops SMS business and is engaged in the overall development design, manufacturing, and maintenance of electronic devices and more. We possess various implementation technologies, development/design technologies, and evaluation/analysis technologies, so please feel free to consult us if you have any requests.