Introducing technologies compatible with wet dicing and dry dicing!
We would like to introduce the dicing technology of Niigata Seimitsu Co., Ltd. In the dicing process, we can accommodate both wet dicing, which uses pure water to cut substrates and wafers, and dry dicing, which cuts substrates without using pure water. 【Supported Dicing】 ■ Wet Dicing (Substrate) ■ Wet Dicing (Wafer) ■ Dry Dicing (Substrate) *For more details, please refer to the PDF materials or feel free to contact us.
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【Specifications (Excerpt)】 〈Wet Dicing (Substrate)〉 ■ Ring Size: 6-inch, 8-inch rectangular ring ■ Substrate Size ・6-inch MAX: 115(L)×73(W)mm ・8-inch rectangular (single layer) MAX: 150(L)×120(W)mm ・8-inch rectangular (double layer) MAX: 120(L)×73(W)mm For other sizes, please consult us. 〈Dry Dicing (Substrate)〉 ■ Ring Size: 8-inch rectangular ring ■ Substrate Size MAX: 150(L)×120(W)mm ■ Cut Line Width MIN: 0.3mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Niigata Seimitsu Co., Ltd. primarily develops SMS business and is engaged in the overall development design, manufacturing, and maintenance of electronic devices and more. We possess various implementation technologies, development/design technologies, and evaluation/analysis technologies, so please feel free to consult us if you have any requests.