We will introduce the technology for picking up by suction and transferring to chip trays and JEDEC trays.
Introducing the pickup process technology of Niigata Seimitsu Co., Ltd. In the pickup process, products that have been diced (such as wafers, devices, modules, etc.) and attached to a ring with UV tape are picked up using suction and repackaged into chip trays or JEDEC trays. 【Supported Specifications】 ■ Ring Size: 8-inch rectangular ring ■ Pickup Size Range: □1mm to □25mm ■ Tray Size: Chip tray, JEDEC tray *For more details, please refer to the PDF document or feel free to contact us.
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【Other Related Processes】 ■ Dicing: Wet and Dry Dicing ■ Emboss Taping: Tray to Taping *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Niigata Seimitsu Co., Ltd. primarily develops SMS business and is engaged in the overall development design, manufacturing, and maintenance of electronic devices and more. We possess various implementation technologies, development/design technologies, and evaluation/analysis technologies, so please feel free to consult us if you have any requests.