Introduction of a printed circuit board with a 0.3 pitch 144 pin BGA featuring via-on-via with copper plating!
Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "6-layer 2-2-2 build-up substrate" is a printed circuit board equipped with a 0.3 pitch 144 pin BGA. It features via-on-via with via fill copper plating. The core part has 2 layers of through-hole (TH) with resin filling and cover plating, and the resist is exposed using laser via DI. 【Features】 ■ Via-on-via with via fill copper plating ■ Core part 2-layer TH with resin filling and cover plating ■ Core part 2-layer TH with φ0.2 drill / land diameter φ0.25 *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Specifications】 ■BGA Pad: φ0.22 (Resist opening φ0.24) ■Resist: Laser exposure using DI ■Laser hole diameter: φ0.1 *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Daishin Sangyo Co., Ltd. is a trading company that has been selling products related to electrical and electronic goods for many years. We offer a wide and rich selection of products, ranging from FA products, printed circuit boards, equipment, to various processed goods. Based on our experience and knowledge, we propose appropriate plans to our customers.