This is a residue-free solder paste that leaves almost no flux residue after reflow.
"NP303-FLV-T4" is a flux residue-free solder paste that exhibits excellent wettability even on difficult-to-wet substrates such as nickel. It supports N2 + vacuum reflow, which also suppresses void formation. Please feel free to contact us if you have any inquiries. 【Features】 ■ No cleaning required ■ Good wettability ■ Suppresses void formation *For more details, please download the PDF or contact us.
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We provide high-performance solder that meets global standards.
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