Developed an epoxy resin formulation that foams and cures upon heating!
We have developed an epoxy resin formulation that expands and hardens through heating, and we handle a sheeted version (B-Stage) of this "epoxy foam resin." It can be used alone, but when forming composite materials, it can be molded and foamed all at once. This eliminates the need for the molding, polishing, and bonding processes of conventional foaming materials, leading to a reduction in processing time. 【Advantages】 ■ Can be combined with composite materials for one-step molding ■ Can be applied to surfaces such as the top and sides ■ Foam thickness (amount of foaming) can be adjusted by layering ■ Easy to cut to fit shapes ■ Easy to manage usage amounts *For more details, please download the PDF or contact us.
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basic information
【Usage】 ■Weight reduction of CFRP molded products ■For internal pressure molding of curved molded bodies, etc. *For more details, please download the PDF or contact us.
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For more details, please download the PDF or contact us.
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Company information
Our company has established four business areas: "Electric and Electronic Materials," "Semiconductor Materials," "Construction and Industrial Materials," and "Composite Materials," and we conduct specialized resin development for each field. Based on three strengths—"responsiveness" to quickly and reliably meet customer needs, "development capability" that leverages over 50 years of accumulated know-how, and "technical capability" honed through involvement in advanced fields—we provide suitable resins and solutions. Please feel free to contact us with your requests.