Dicing processing (straight lines) and machining processing (curves) also achieve integrated processing.
Our company provides cutting (dicing) and grinding (thinning) processing technologies primarily for semiconductor silicon wafers. Additionally, this processing technology is extended to a wide range of materials that are considered difficult to process, such as optical glass, ceramics, and SiC sapphire. We cut IC chips smaller, thinner, and with greater precision. Furthermore, you can also rely on us for round processing, curves, and precision hole drilling. 【Features】 ■ Processing can be done using pure materials in a clean environment ■ Equipped with ultrasonic functions for precise processing of difficult-to-machine materials ■ Integrated processing within the same process *For more details, please download the PDF or contact us.
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【Our Strengths】 ■ No restrictions on quantity ■ No restrictions on materials ■ No restrictions on specifications *For more details, please download the PDF or contact us.
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Suntech Co., Ltd. has been advancing step by step as a technical group in semiconductor processing since its establishment, receiving strong support from our customers and serving as a member of the semiconductor industry. Since the birth of the processing technology known as "dicing," we have collaborated with equipment manufacturers to refine our microfabrication techniques. We not only provide technology for dicing processing but also pursue Q (Quality), D (Delivery), and S (Service) to deliver satisfaction to our customers. We assist a wide range of clients, including major semiconductor glass manufacturers and venture companies. We aim to foster the individuality of each employee, providing an environment where their strengths can be fully realized, and we are united in our efforts to achieve the highest quality in dicing processing and engage in environmentally conscious corporate activities.