Spray and etching analysis using the SPH method! We are introducing it clearly with the use of diagrams.
This document introduces the spray and etching analysis using the SPH method. First, we will simulate the oscillating spray of the etching solution. Next, we will analyze the phenomenon of copper being etched due to the ionization reaction between the etching solution and copper after the etching solution is sprayed onto the copper plate. Please take a moment to read it. [Contents] ■ Overview of spray and etching analysis ■ Etching model ■ Progress of corrosion on the copper plate *For more details, please refer to the PDF document or feel free to contact us.
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A.C.T. Corporation mainly engages in the sales and technical support services of various general-purpose CAE package products. We handle products such as CAE analysis software, experimental and measurement systems, and artificial intelligence and expert system applications. Please feel free to contact us if you have any inquiries.
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