Achieve high precision and uniform finishing with unique oscillation! We offer flexible customization from experimental machines to mass production equipment.
After applying the resist to printed circuit boards or glass substrates, we dissolve the unnecessary resist portions that were exposed during the patterning process. Compared to horizontal conveyor-type developing machines, the upright conveyor type has less liquid pooling during spraying, allowing for high-precision developing processes. There is also the advantage of a slightly more compact developing section. Our company has a diverse track record, ranging from standalone developing machines to inline models integrated with post-bake processes. 【Features of Our Equipment】 ■ Uniform processing on both sides ■ Automatic pressure adjustment function for spraying ■ Visualization of the work during processing through transparent processing tanks ■ Automatic liquid replenishment function with a developing liquid concentration management system ■ Designed with a focus on chemical resistance for long-lasting equipment ■ Complete safety interlock system ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ Example of Processing 【Product】3mm 【Product Size】4500 (width) × 2200mm (height) 【Main Chemicals】Alkaline developing solution ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ 【Note】 - Proposals, designs, and manufacturing are possible from development prototypes.
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◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ ○Flow item: 1 sheet transport ○Transport speed: 7m/min ○Material dimensions: 4500mm (horizontal) × 2200mm (vertical) ○Material thickness: 3mm ○Processing surface: One side or both sides ○Equipment configuration: Upright CV → Development → Washing → Liquid draining → Tilting CV → Discharge CV ○Utilities ・Power supply: AC200V・220V / 50Hz・60Hz ・Dry air pressure, pure water, cooling water, washing wastewater, development wastewater, development waste liquid, general exhaust ○Equipment dimensions: Based on material size ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆
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◆Glass Etching machine ◆Resist Coating | Developing Machine | Metal Etching | Resist Stripping | Cleaning machine ◆Electropolishing machine ▼▼▼Our Strengths▼▼▼ ◎Glass Etching Precision Achievable in glass substrates with a work size of 1500×1850mm, with a post-processing in-plane thickness precision of R10μm or less. ◎Thin Sheet Transport Mechanism We possess multiple know-hows for transporting thin sheet workpieces, both metal sheets and glass substrates, without causing damage. ◎Material Selection The selection of materials for the equipment is a critical task related to safety, environment, and quality. We conduct evaluation tests using chemical solutions as necessary and take responsibility for the selection. ◎Prototype Processing Available We can process samples using not only water but also chemical solutions (acidic chemicals, alkaline chemicals, organic solvents). You can purchase the equipment with confidence after verification and evaluation.
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