Vacuum and Pressure Reflow Furnace 'VPF300'

With technical data included, significantly reduces void ratio under a maximum pressure of 0.4 MPa. Improves process efficiency with rapid cooling. Compatible with fluxless soldering.

The VPF300 is a vacuum and pressure reflow oven that not only creates a vacuum (reduced pressure) inside the chamber but can also apply pressure up to 0.4 MPa, significantly reducing the void rate inside the solder and achieving high-quality soldering. Process conditions such as chamber pressure and heating temperature can be set for each workpiece, and efficient heating and cooling are possible thanks to its unique rapid cooling function. Additionally, it supports formic acid reduction reflow and forming gas reflow, allowing for the establishment of a flux-free soldering process. The 2023 model has improved the cooling mechanism, enhancing maintainability. 【Features】 ■ A wide effective heating area of 300×300 mm ■ Maximum heating temperature of 450℃ ■ The vacuum chamber is equipped with an observation window ■ Features an intuitive touch panel GUI for easy operation *Product documentation can be viewed via "PDF Download." Please feel free to contact us if you wish to request a test.

Reflow EquipmentSoldering Equipment