With technical data included, significantly reduces void ratio under a maximum pressure of 0.4 MPa. Improves process efficiency with rapid cooling. Compatible with fluxless soldering.
The VPF300 is a vacuum and pressure reflow oven that not only creates a vacuum (reduced pressure) inside the chamber but can also apply pressure up to 0.4 MPa, significantly reducing the void rate inside the solder and achieving high-quality soldering. Process conditions such as chamber pressure and heating temperature can be set for each workpiece, and efficient heating and cooling are possible thanks to its unique rapid cooling function. Additionally, it supports formic acid reduction reflow and forming gas reflow, allowing for the establishment of a flux-free soldering process. The 2023 model has improved the cooling mechanism, enhancing maintainability. 【Features】 ■ A wide effective heating area of 300×300 mm ■ Maximum heating temperature of 450℃ ■ The vacuum chamber is equipped with an observation window ■ Features an intuitive touch panel GUI for easy operation *Product documentation can be viewed via "PDF Download." Please feel free to contact us if you wish to request a test.
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basic information
<Other Features> - Excellent cooling system that shortens process time - Upper and lower heating mechanism with adjustable output settings for each heater - Optional bubbler for mixing nitrogen gas and formic acid - Flexible process construction based on time, temperature, and pressure - Measurement data for temperature and pressure can be saved to a PC - Equipped with six thermocouples for temperature measurement inside the vacuum chamber - Flexible process construction possible with five gas lines - Can be linked with formic acid concentration monitor (optional)
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Company information
Our company was founded in 1976 in Okaya City, Nagano Prefecture, and since then, we have expanded our export business of machine tools to the Chinese and Southeast Asian markets. Starting in 1997, we began importing, selling, and servicing equipment for the electronics industry. Currently, we are also working on the development of our own products, such as various reflow soldering machines and ultrasonic metal joining devices, to meet market needs.