Replacing conventional Pi with protective films and interlayer insulation films that require transparency!
Recently, there have been many inquiries about the application of transparent resist and fine processing patterning. Due to its insulating and transparent properties, it is suitable as a protective film for substrates and interlayer insulating films, replacing conventional PI. Thick films are used for the formation of microchannel molds.
Inquire About This Product
basic information
■Specifications Pattern Width Possible from 5 (3) μm Film Thickness Approximately 0.6 to 30 μm Coating Area Up to 300×300 mm can be considered *The processing details depend on the pattern length, shape, and substrate material, so please contact us for inquiries. *In the future, we will also challenge L/S below 3 μm, so please contact us for inquiries.
Price range
Delivery Time
Applications/Examples of results
Examples of Use - Due to its insulation properties and transparency, it can be used as a protective film or interlayer insulating film instead of conventional PI. - Additionally, it is photosensitive, allowing for partial patterning. - It can be used as a resist material for full additive plating in metal mesh film processing.
Detailed information
-
Microfluidic chip
catalog（2）
Download All Catalogs
Company information
Specifically, we receive requests for patterning processing on substrates for ACF, organic EL, material evaluation, MEMS, solar cells, and equipment evaluation using photolithography and etching technology from various companies, public research institutions, and research and development departments of universities. We specialize in fine pitch patterning of thin metal films, but we can also consider processing methods for thick films depending on the specifications, so please feel free to consult with us. Additionally, we also accept sputtering deposition processing only. We handle processing not only for glass substrates but also for various film substrates such as PC, PET, and PI. We also accept orders for substrate and film arrangement.