Bonding of thin glass unique to G/GTP's cultivated technology print.
We assist in the production of empty cells and other items using our thin glass bonding technology developed with glass/glass touch panels. Additionally, our glass edge cutting for bonded glass is also well-regarded.
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basic information
We will assist in the production of empty cells and other items using the thin glass laminating technology developed with glass/glass touch panels. Processing details: - Glass + glass lamination (step cutting possible). Glass + film lamination (specifications to be discussed). Processing size: - Processing is possible for glass substrates up to a maximum of 400mm x 360mm. Thickness can be accommodated from ±0.2mm. G+F: (specifications to be discussed). Processing achievements: - Glass + glass with a gap of 10 to 30μm (laminated with adhesive).
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Applications/Examples of results
- MEMS component package - Empty cell for LCD evaluation
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Company information
Specifically, we receive requests for patterning processing on substrates for ACF, organic EL, material evaluation, MEMS, solar cells, and equipment evaluation using photolithography and etching technology from various companies, public research institutions, and research and development departments of universities. We specialize in fine pitch patterning of thin metal films, but we can also consider processing methods for thick films depending on the specifications, so please feel free to consult with us. Additionally, we also accept sputtering deposition processing only. We handle processing not only for glass substrates but also for various film substrates such as PC, PET, and PI. We also accept orders for substrate and film arrangement.