The PbS infrared sensor that adopts trinamiX's thin-film encapsulation technology achieves excellent stability even in a thin bare chip.
The PbS infrared sensor, utilizing trinamiX's thin-film encapsulation technology, achieves excellent stability even in a thin bare chip. It is less affected by environmental factors such as moisture and oxygen, which helps suppress degradation. The size and shape of the bare chip are highly suitable for automated assembly, allowing for miniaturization of many application products and contributing to reduced assembly costs. The standard light-receiving area dimensions of the bare chip range from 0.5x0.5mm² to a maximum of 10x10mm².
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basic information
PbS near-infrared detector Single-Pixel thin-film encapsulated Features • Bondable electrode for COB mounting • High durability for rugged operation • Very high sensitivity • Room temperature operation
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Applications/Examples of results
Applications • Flame monitoring • Flame and spark detection • Gas detection and analysis • Spectroscopy • Temperature measurement • Moisture measurement
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If you have any inquiries regarding infrared technology, please feel free to consult us. We will introduce you to the world's cutting-edge technologies. We handle a wide range of infrared equipment, including blackbody furnaces, spectrometers, infrared cameras, CO2 monitors, and wafer temperature monitors, as well as infrared sensors, windows, lenses, and other infrared components. We also offer measurement services and equipment rentals. If you are unsure about selecting optical components such as infrared sensors, filters, or window materials, please do not hesitate to contact us.
