Responding to lightweight development projects through volume removal! Introducing ultra-thin precision machining.
This is an introduction to "Ultra-thin Precision Cutting Processing" handled by Hibiki Seiki Co., Ltd. The foundation of our technology was built on vacuum components in the semiconductor industry, specifically micron-level processing of thin-walled metal parts commonly used in this field. We have been continuously improving our skills while facing the demands of this technology for a long time. Recently, we have been proposing added value through ultra-thin precision cutting processing for parts aimed at lightweight development, including in the aerospace sector. [Features] ■ Supports lightweight development projects through volume removal *For more details, please refer to the external link page or feel free to contact us.
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Hibiki Seiki opens up the 21st century. A new human-tech where people, technology, and machines resonate with each other. The main character is, after all, people. We nurture people, and people create technology. We want to continue to cherish this relationship between people and technology. From now on, we will continue to challenge ourselves with further possibilities, proud of our contribution to society.