It is possible to keep internal stress low! The stability of the bath is high, and liquid management is easy.
"US-01" is a copper sulfate plating additive for flexible printed circuit boards. The deposited film is highly ductile and has excellent thermal shock resistance, allowing for lower internal stress compared to conventional additives. Additionally, it has high bath stability and is easy to manage the liquid. [Components] ■ Copper sulfate CuSO4·5H2O (g/L) ■ Sulfuric acid H2SO4 (G/L) ■ Chloride ion Cl- (ppm) ■ US-MU (mL/L) ■ US-01 (mL/L) *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Prime Technology Co., Ltd. mainly engages in the manufacturing, sales, and import/export of acoustic device components (micro speakers). With our extensive experience and knowledge, we are here to support our customers, so please feel free to contact us with any requests.