High-density implementation of MiniLED
At Ings Shinano, we are working on the development of die bonding implementation for small semiconductor devices. We have made it possible to mount small chips down to 0.1mm.
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basic information
Specifications Supported board size: □20 to □300mm Supported chip size: □0.1mm and above Mounting accuracy: X, Y ±25um (3σ), ±3° Board supply: Magazine Chip supply: Sheet ring (GR4 ~8 inch)
Price range
P3
Delivery Time
※The delivery time may vary depending on the congestion of the equipment, so please feel free to contact us.
Applications/Examples of results
Backlight for LCDs, next-generation displays, digital signage, etc.
Company information
Empathy for People, Progress Towards Dreams "Ings Shinano Co., Ltd." was founded in 1946, and this year marks our 75th anniversary. During this time, thanks to the support of many clients and the local community, we have been able to expand our business in the fields of electronic component prototype and mass production, as well as assembly for electronic devices, optical devices, and information equipment. We sincerely thank everyone involved for their support. The name "Ings" combines the English present continuous form "ing" with the plural "s," reflecting our desire to be a company that is always advancing in various fields. True to our name, we continually challenge ourselves in new businesses and areas, boldly pursuing infinite possibilities while remaining "in the present continuous." With the goal of achieving "the best responsiveness in Japan" in the field of bare chip and mixed mounting prototype assembly, we are establishing a system to respond swiftly to customer requests, even starting from a single circuit board or wire. Going forward, we will continue to expand our business with the motto "Empathy for People, Progress Towards Dreams," engaging all employees across the company. We look forward to your inquiries and requests. Thank you very much for your continued support.