Introducing a laser deburring device capable of removing resin from metal parts!
The "Laser Resin Removal Device" is a device designed to remove excess black resin parts from various semiconductor products. It is capable of removing resin from metal parts, separating products, and removing resin gates from product sections. It supports products such as SOP series matrices, power modules, and TO-220/TO-3P series. 【Features】 ■ Removes excess black resin parts from various semiconductor products ■ Capable of removing resin from metal parts and separating products ■ Compatible with products such as SOP series matrices *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications (Excerpt)】 ■ Loader Section - Stacker Magazine / Slit Magazine - Uncoiler / Inline / Manual Insertion ■ Frame Transfer: Suction Transport / Chuck Transport ■ Processing Point Positioning: Mask Type Pin Method / Mask Type Side Clamp Method ■ Processing Position Correction: 2 Megapixel Image Processing Mechanism (±10μ correction possible) *Optional ■ Post-Processing Residue Removal: Rotating Brush + Air Blow + Dust Collection *Optional *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ Various semiconductor device products *For more details, please refer to the PDF document or feel free to contact us.*
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Company information
Daiyon Densan Co., Ltd. is a company that designs and manufactures a wide range of equipment, from complex systems equipped with a series of processes such as semiconductor lead processing equipment, laser processing equipment, inspection, and loaders/unloaders, to standalone functional devices. Additionally, our equipment design responds to customer requests across various fields, including automotive parts assembly equipment and electronic components assembly. If you have inquiries such as "the equipment manufacturer turned me down" or "I need good ideas for labor-saving," please feel free to contact us.
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