Silver powder that achieves world-class conductivity and low-temperature sintering characteristics.
Attention semiconductor and circuit board designers! Are you looking to enhance the conductivity of your products and reduce the sintering temperature? There are silver nanoparticles that exhibit remarkable performance in semiconductors and circuit boards, which are increasingly demanding higher performance. Introducing "TOSFINE" from Tokusen Industries. "TOSFINE" is produced using our unique particle manufacturing technology, which processes each particle into a flake shape, resulting in silver powder that combines the handling properties of flakes with the characteristics of nanoparticles. "TOSFINE" boasts high conductivity and high mirror-like finish under dry conditions due to its highly smooth surface. 【Features】 - Achieves high conductivity and heat dissipation with single crystal flakes. - Exhibits sintering properties at low temperatures (120-200°C). - Realizes high conductivity even under dry conditions due to its high surface smoothness. - Offers a uniform particle size distribution thanks to our unique manufacturing method. - We can propose particle sizes and surface treatments tailored to your applications.
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basic information
【Products Handled】 Silver nanoparticles / Silver powder / Silver flakes / Single crystal silver flakes
Price information
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Delivery Time
※Usually 1 month
Applications/Examples of results
- Solar cell electrode paste and ink - Display electrode paste - Touch panels, plasma displays - Adhesives for bonding electronic and electrical components - Conductive paste for circuit boards - Fillers for metallic ink
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Company information
Since our establishment in 1934, we have leveraged the technological capabilities we have cultivated and the infinite potential unique to material manufacturers. We have received high praise from our customers in a wide range of fields, including tires, engine parts, medical, semiconductors, home appliances, and solar power, starting with wires used in these applications. Moving forward, we will continue to expand our broad innovations, diversity, and globalization, creating new trust, safety, and innovation through our core technologies.