[Case Study on Problem Solving] Mold Edition: Wear Prevention Measures for Power Type Molds
Changed the surface treatment of the gate runner! Successfully doubled the hardness and tripled the lifespan!
We would like to introduce a case where our company solved the issue faced by a client regarding the rapid wear and short lifespan of the gate and runner sections of power-type mold dies. The encapsulation resin for power semiconductors contains a high amount of silica, and the surface treatment of standard mold dies (HCr) has a hardness of HV800 to 1000, which is soft and leads to rapid wear. Therefore, by changing the surface treatment of the gate and runner sections and increasing the hardness to more than twice (HV1800 to HV2000), we successfully extended the lifespan by three times. [Case Study] ■ Issue: Rapid wear and short lifespan of the gate and runner sections of power-type mold dies ■ Solution: Tripled lifespan through changes in mold surface treatment *For more details, please refer to the external link page or feel free to contact us.
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Our company's philosophy is that the future is led by us. Our standards of conduct are sincerity, prompt action, and teamwork. We handle the design and manufacturing of all FA-related devices and parts. We have started modeling 3D data. We create 3D data from 2D drawing data. We also accommodate data creation for presentations and 3D printers. *3D data will be delivered in intermediate file formats (IGES, STEP, Parasolid). Please feel free to contact us.