Drilling fine through-holes in various glass materials! We also introduce case studies of fine hole drilling.
We would like to introduce the "microhole drilling" glass etching technology conducted by ForSight Inc. In the semiconductor industry, where high integration is required, this technology is essential not only for products but also for the development of manufacturing processes, making it suitable for applications such as TGVs, support substrates, and spacers. Additionally, there are examples of its application in the development of materials that enable electrode wiring in three-dimensional (3D) structures, not just traditional two-dimensional (2D) electrode wiring. Regarding the minimum diameter and minimum pitch, the specifications will vary primarily based on the thickness of the board, so please consult us. 【Features】 ■ Micro through-holes drilled in various glass materials ■ Minimum diameter and minimum pitch specifications vary based on board thickness *For more details, please refer to the PDF document or feel free to contact us.
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【Product Examples】 ■ Spacer for 3D Camera ・φ200×0.3t E-XG ・Hole diameter φ1.5mm > 5,000 holes ■ MEMS Cap Glass ・φ200×0.3t E-XG ・Depth 0.3mm ■ Glass Tray ・□100×0.2t TPX ・Hole diameter φ1mm ■ Glass Tray ・□200×0.2t AN100 ・Hole diameter φ1mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company aims to be a development and proposal-oriented trading company, prioritizing the realization of customer solutions rather than being a traditional trading company that simply sells "goods," particularly in the flat panel display industry. We will continuously focus on cutting-edge technological trends and strive to play a role in the creation of new products through collaboration with multiple companies.
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