For expansion systems, compatible with 9th generation CPUs, capable of dual GPU card installation, and supports extended temperature range.
Features ■ Width 242.7 × Height 208.9 × Depth 369.2 mm, 18.7 liters ■ 9th generation Xeon/Core i7/i5/Celeron CPU (Coffee Lake Refresh) ■ DDR4-2666MHz (up to 64GB) ■ Supports up to 2 GPUs via 4 PCIe[x16] ■ Can accommodate 2 GPUs (NVIDIA Tesla/Quadro/Geforce or AMD Radeon) with a 750W specification powered by a 1500W power supply ■ 4K resolution support, 3 independent display outputs ■ Maximum data transfer speed of 10Gbps via 4 USB3.1 ■ 4 GbE, 4 COM, 16 DIO ■ Extended temperature range -25 to 60°C ■ Wide DC input 9 to 55V ■ Remote power ON/OFF ■ Railway standard EN50155 certified
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basic information
Specifications ■CPU/Chipset: 9th Generation Xeon/Core i7/i5/i3 (Coffee Lake Refresh) / C246 ■Memory: DDR4-2666MHz SO-DIMM x 2 (up to 64GB) ■Expansion Slots: Mini PCIe x 2, PCIe[x16] x 2, PCIe[x16] x 1, PCIe[x16] x 1 ■Storage: 2.5" HDD/SSD x 2 SATA III (6Gbps), mSATA SSD x 1 ■I/O Connectors: Ethernet: LAN 1 GigE LAN, LAN 2-4 GigE LAN, USB3.1 x 4, RS-232/422/485 (ESD 8KV) x 4 (Dsub-9), DVI-D x 1, DP x 2, Isolated DIO x 1, Audio Mic-in, Line-out ■Input Power: DC 6-55V input ■Operating Temperature: -25 to 60℃ ■Dimensions (mm)/Weight (kg): 242.7(W) x 208.9(H) x 369.2(L) / 9
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Open price
Delivery Time
※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
Line up(1)
Model number | overview |
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GPC-1000 | GigE LAN x 4, PCIe[x16] x 4, 10GUSB x 4, SIM x 1, Isolated DIO x 16 |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.