0.9mm pitch small low-profile wire-to-board connector
The 8041 series is a wire-to-board connector developed to meet the demands for high-density mounting in the market, particularly for small communication devices, achieving an industry-low height of 0.9mm (as of March 2017, according to our research) with a pitch of 0.9mm and 2 contacts, making it an ultra-compact and ultra-low-profile type.
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basic information
- Achieved the industry's lowest height class (H=0.9mm). Compared to our conventional products (8040 series), it realizes approximately 1/3 in area ratio and about 1/2 in volume ratio for space-saving. (Note: As of March 2017, based on Kyocera research) - Adopted a "two-point contact structure" that is resistant to vibration and drop impact, achieving high contact reliability. The applicable wire gauge remains the same as before, compatible with AWG#32. - Utilized a four-point insulator lock structure that is strong against shock and vibration. Despite its low profile, it provides excellent click feel and mating retention force. - Prevents solder wicking with a nickel barrier. - Contact material: Copper alloy - Insulator material: Heat-resistant resin - Operating temperature range: -55℃ to +85℃
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Applications/Examples of results
Smartphones, tablet PCs/laptops, wearable devices, digital still cameras/digital video cameras, AV equipment, etc.
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Kyocera offers electronic components that are installed in a wide range of devices, from everyday products like smartphones and wearable devices to industrial equipment. Utilizing cutting-edge technology and maintaining high quality throughout the development and mass production processes, we contribute to the evolution of electronics.