Attention quality control and production management departments! We will introduce the verification results of vacuum pressure reflow, which is effective in reducing voids.
This document discusses the void reduction effects of vacuum pressure reflow. Using a vacuum reflow furnace, a method of reducing voids in solder joints through defoaming and compression is commonly utilized. However, to verify even more effective methods, we conducted reflow soldering using three different conditions and various test samples, and we present the results in detail with images. Please feel free to download and take a look. 【Contents】 ■ Importance of low-void soldering ■ Verification of effective processes for void reduction ■ Test samples ■ Test results ■ Summary of results *For more details, please refer to the PDF document or feel free to contact us.
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Our company was founded in 1976 in Okaya City, Nagano Prefecture, and since then, we have expanded our export business of machine tools to the Chinese and Southeast Asian markets. Starting in 1997, we began importing, selling, and servicing equipment for the electronics industry. Currently, we are also working on the development of our own products, such as various reflow soldering machines and ultrasonic metal joining devices, to meet market needs.
![Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]](https://image.mono.ipros.com/public/product/image/e71/2001537352/IPROS10975729606287656253.jpg?w=280&h=280)
