Customizable upon request! Introducing a solder ball mounting device with an accuracy of ±0.05mm.
Our company handles "solder ball mounting devices." The ceramic substrate mounted on the transport carrier is removed, followed by solder paste printing, solder ball mounting, and quality inspection through image processing. After that, it is mounted on a pallet for reflow and discharged for reflow. Additionally, we can customize according to your requests. Please contact us when you need assistance. 【Specifications】 ■ Ceramic substrate size: 19mm × 12mm × 0.8mm ■ Mounted solder ball: diameter 0.65mm ■ Number of solder balls mounted: 112 pieces ■ Mounting accuracy: ±0.05mm ■ Cycle time: 24 seconds (2 boards) 12 seconds/1 board *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Specifications】 ■ Equipped with image processing camera: Misalignment of the board and the substrate, misalignment of the substrate position during mounting, ball inspection before mounting, ball inspection after mounting ■ Device size: Width 1,500mm, Depth 1,200mm, Height 1,600mm * For more details, please refer to the PDF document or feel free to contact us.
Price range
P7
Delivery Time
※The delivery date may vary depending on the specifications, so please feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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