Leave it to us when it comes to double-sided grinding machines.
We have received high praise from customers in various fields for our grinding, polishing, cutting, and have developed technologies for flying line grinding, wrapping and polishing related equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid foundation of trust.
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【Features】 - Simultaneous grinding (polishing) on both sides with two upper and lower grinding stones - 5 to 10 times the processing efficiency compared to conventional lapping methods - High-precision parallel planes are achieved through the workpiece's planetary motion - Automated transport system For inquiries regarding cutting and polishing machines, please contact us.
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We have received high praise from customers in various fields for our grinding, polishing, and cutting technologies. We have developed technologies related to fine grinding, wrapping and polishing equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid reputation for reliability. Moving forward, we aim to propose even better products and contribute to society in various ways.