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  3. Electronic Components and Modules
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  5. Printed Circuit Board
  6. Ceramic substrate

Ceramic substrate

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last updated:Aug 05, 2020

橋本理研工業
橋本理研工業
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We provide ceramic substrates that combine excellent smoothness, bending strength, and insulation properties!

Our company mainly handles "ceramic substrates" used for HIC substrates, thin-film circuit substrates, heat dissipation substrates, and LED mounting substrates. "Ceramic substrates" have fewer pores due to the use of fine particles, exhibiting excellent smoothness, high bending strength, and insulation even in high-temperature environments. We can accommodate requests for through-hole and scribe line processing, as well as electrode pattern formation (metallization) through printing and plating. 【Product Lineup】 ■ Thick film printing substrates ■ Alumina metallized substrates ■ Long-length substrates for thick film printing ■ Thin film printing substrates ■ Polished substrates for thin film printing, etc. *For more details, please download the PDF or feel free to contact us.

    Printed Circuit BoardCeramics
セラミック基板.PNG

Ceramic substrate

セラミック基板.PNG
セラミック基板.PNG
  • Related Link - http://h-riken.co.jp/service.html

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【Other Lineup】 ■Single Crystal Sapphire Substrate ■High Reflectivity Alumina Substrate *For more details, please download the PDF or feel free to contact us.

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Product Catalog: Ceramics for Electronic Industry

Product Catalog: Ceramics for Electronic Industry

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橋本理研工業

橋本理研工業

Ceramics

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Sales of mechanical parts made from various ceramic materials. Metal processed parts through ultra-precision machining. Large resin processed products measuring 2M x 1M. Mechanical parts made from various carbon materials. Glass processed parts such as quartz glass, Tempax, and Pyrex. Ceramic thermal spraying onto metals, resins, etc. Affordable and short delivery sales of thermocouples.

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  • Electronic Components and Modules
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  • Printed Circuit Board
  • Materials
  • Ceramics
          

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