Supports one-sided processing up to approximately 2.0mm! In composite processing, the taper of the cross-section is suppressed. Irregular shapes can also be reproduced.
Our company's "substrate etching and lamination processing" can accommodate single-sided processing up to approximately 2.0mm. In composite processing, the taper of the cross-section is suppressed. Irregular shapes can also be reproduced. The thickness of the material can be increased further (consultation required). 【Processing Capabilities】 ■ Single-sided etching ■ Double-sided etching ■ Composite processing etching + α *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Processing Technology】 ■Etching ■Etching + Laser (Wire) ■Etching + Bonding *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Uses/Applications】 ■DBC substrate ■Lead frame ■Heat sink *For more details, please refer to the PDF document or feel free to contact us.
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Company information
With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.