6th/7th generation Core i7/i5/i3/Pentium/Celeron, 2xDDR4-2133 up to 64GB
Features ■ Supports LGA1151 Intel(R) Skylake-S processors ■ Supports dual-channel DDR4 2133MHz ■ Supports triple display (HDMI, DVI, VGA) ■ PCIe Gen3.0 with 8GT/s I/O bandwidth ■ USB3.0, SATA 6Gb/s ■ Supports SATA Express ■ IPMI 2.0 compatible with optional iRIS-2400 ■ Ideal for OS backup and recovery with IEI One Key Recovery solution
Inquire About This Product
basic information
Specifications ■CPU: LGA1151 socket, 6th generation Core i7/i5/i3/Pentium/Celeron ■Chipset: Q170 ■Memory: 288-pin 2133MHz DDR4 SDRAM x 4 slots (maximum 64GB) ■Display Output: DVI-D, VGA, HDMI 2.0, iDP ■Rear I/O: Gigabit LAN x 2, RS-232 x 1, USB 2.0 x 2, USB 3.0 x 4, Audio (line-out/in, mic-in) x 1 each ■Pin Header I/O: KB/MS x 1, USB 3.0 x 1, LPT x 1, USB 2.0 x 1, mSATA x 1 (shared with SATA2), USB 2.0 x 4, RS-232/422/485 x 2, RS-232 x 4, SATA 6Gb/s x 6, TPM x 1 ■Expansion Slots: Full-size PCIe mini card x 1 (mSATA compatible), PCI x 2, PCIe (8) (Gen3) x 2, PCIe (4) x 3 (Gen3) ■Digital I/O: 8-bit digital I/O ■Power Supply: AT/ATX ■Operating Temperature: -20°C to 60°C ■Operating Humidity: 5~95% (non-condensing) ■Dimensions: 244 x 305mm ■Weight: 700g
Price range
Delivery Time
P4
Applications/Examples of results
Factory and Building Automation / Multimedia Systems / Digital Signage
Line up（1）
| Model number | overview |
|---|---|
| IMBA-Q170-i2-R10 | Supports 14nm LGA1151 Intel Core Intel Q170, DDR4, Three Independent Displays VGA/ DVI-D / HDMI 2.0/ Dual Intel PCIe GbE, USB 3.0, SATA 6Gb/s, HD Audio, IPMI2.0 and RoHS |
catalog（1）
Download All Catalogs
Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.