Welding head, cutting head, scanner head
IPG manufactures all the optical beam delivery units necessary for industrial lasers in-house. With a wide variety of head types, it supports various applications including precision machining, welding, cutting, marking, and surface treatment.
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- Welding Head (Wobble Head) The welding head [FLW series] is designed to supply the maximum amount of laser output. Additionally, the integrated wobble function allows for more flexible processing. - Cutting Head The cutting head [FLC-30] is a cutting head that enables laser processing with high airtightness, lightweight design, and excellent operability. The fine cutting head [FLC-MC] is a micro cutting head equipped with a spot diameter and focal length adjustment mechanism optimized for fine processing. - Scanner Head The scanner for remote applications is ideal for applications that require high beam quality, such as high-speed remote welding or cutting, due to the high-quality beam mode of fiber lasers. - Integrated Marker The integrated laser marker, which combines a 2-axis scanner and a pulsed fiber laser, is characterized by its compact design and high operability.
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Laser processing
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IPG Photonics is a manufacturer of high-performance fiber lasers for industries such as automotive and machine tools. As a pioneer in fiber laser technology, it leads the industry by providing a range of low, medium, and high-power laser oscillators and amplifiers that are highly applied in material processing, communications, and medical fields. IPG Photonics has production bases in the United States and Germany, expanding its business globally and experiencing significant growth alongside the rapid advancement of laser technology. IPG Photonics' products are increasingly replacing traditional methods in the industrial sector and continue to explore new applications for lasers. IPG Photonics Japan Co., Ltd. was established in 2004 as the Japanese subsidiary of IPG Photonics, aiming to provide prompt and comprehensive services to domestic customers.