Railway and vehicle-mounted, 10th generation CPU compatible, extended temperature range support.
Features ■ Width 260 × Height 79 × Depth 175 mm, 3.6 liters ■ 10th generation workstation-grade Intel Xeon/Core i9/i7/i5/i3 CPU (Comet Lake-S) ■ 2 DDR4 2933MHz memory slots, expandable up to 64GB (ECC memory option available) ■ Equipped with up to 9 independently operating GigE LAN ports, 4 of which support IEEE 802.3at PoE+ ■ Convenient SIM socket for external access, supporting WiFi/4G/3G/LTE/GPRS/UMTS ■ Ignition control via software, TPM 2.0 support ■ User-friendly maintenance features ■ Options for a variety of Ethernet selections (10G LAN/2.5G LAN/10G SFP+/1G SFP) ■ One-stop AIoT solution proposal with OpenVINO x VHub AI option ■ Extended temperature range -40 to 75℃ (when equipped with 35W TDP CPU) ■ Wide DC input 9-50V (80V surge protection) ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certification
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Specifications ■CPU/Chipset: 10th Generation Xeon/Core i9/i7/i5/i3 / W480E ■Memory: DDR4-2933MHz SO-DIMM x 2 (up to 64GB) ■Expansion Slots: PCIe[x16] x1, PCIe[x4] x1 ■Storage: 2.5"HDD/SSD SATA3 x2, mSATA x2, M.2 Key M x1 ■I/O Connectors: Ethernet: GigE x2/GigE(PoE) x4/2.5G x2/SFP x2/10G x2/10G SFP+ x2, USB3.2 x6, USB2.0 x1, RS-232/422/485 x4, DVI-I x1, DVI-D x1, DP x2, 16 GPIO x1, Mic-in, Line-out ■Input Power: DC 9–50V input ■Operating Temperature: CPU 35W/65W/80W–95W & 10G Series: -40–75/55℃ (fanless)/55℃ ■Dimensions (mm)/Weight (kg): 260(W)x79(H)x175(L) / 3.8kg
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Delivery Time
※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.