To customers struggling with the dry film method! Shorten lead time by omitting the DF application and removal processes.
The "die-cut mask" can eliminate dry film (DF) peeling residue defects. Depending on the production volume, the type of die (punch die/mold) can be selected. It shortens the lead time by omitting the DF application and removal processes. Additionally, there is no need for DF inventory management. It can cut waste such as excessive disposal. 【Features】 ■ Die-cut masks can be created from 10,000 sheets. ■ The type of die (punch die/mold) can be chosen based on production volume. ■ The mask tape used is a standard product from Daihei Metal. *For more details, please refer to the PDF document or feel free to contact us.
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【3 Major Benefits】 ■ Elimination of dry film (DF) residue defects ■ Reduction of lead time by omitting DF application and removal processes ■ No need for DF inventory management, cutting waste such as excessive disposal *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Since our establishment, we have been exclusively engaged in "hard gold plating" as a surface treatment for printed circuit boards. Amidst the decreasing number of "hard gold plating" providers, which has caused many circuit board manufacturers to struggle, we continue to focus on "hard gold plating" to meet the needs of our manufacturers. We specialize in "partial gold plating" using labor-intensive tape masking, and we have a team of experienced masking staff to ensure quick delivery times while also meeting our customers' cost requirements.