We can process various materials with high precision, from silicon wafers to crystals and metals.
The "PEG-100-3S" is a diamond grinding machine capable of high-precision processing at 5μm on various materials, including silicon wafers, glass, quartz, and metals. The grinding wheel shaft is controlled by an inverter motor, allowing for variable speed. Additionally, it utilizes a contouring processing method, enabling the machining of various shapes. Changing the processing pressure is easy, and it can process items from thin materials to those with a diameter of Φ100 without chipping. 【Features】 ■ Contouring method with pneumatic pressure control ■ Large screen touch panel ■ Inverter-controlled high-speed spindle *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■ Machine size: 1322(W) × 930(D) × 1115(H) ■ Machine weight: 350Kgf ■ Grinding method: Contour grinding using a template gauge ■ Main body size: 780(W) × 704(D) × 390(H) *For more details, please download the PDF or feel free to contact us.
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Our company manufactures and sells lens processing machines for glasses and semiconductor peripheral polishing machines. We handle innovative frame tracers that accommodate high curves, such as the 'FUJI-300TX PLUS/FUJI-300TX', so please feel free to contact us if you have any requests.