High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate
The cup angle and bottom size can be freely selected! After implementation, the height of the board can be kept low.
This product is a "high-precision device substrate" that allows for a low profile of the board after mounting by installing an IC in the seat groove. It is designed for LED light reflectors, and the cup angle and bottom surface size can be freely selected. In addition, we also offer "high heat dissipation device substrates" and "ultra-thin glass cloth multilayer substrates." 【Features】 <High-Precision Device Substrate> ■ Enables a low profile of the board after mounting ■ Cup angle and bottom surface size can be freely selected <High Heat Dissipation Device Substrate> ■ Combines various heat dissipation technologies to meet advanced requirements ■ Copper pillars do not damage through-hole plating as they are not press-fitted *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Substrates for high-precision devices ・ Reflectors for LED light ■ Substrates for high heat dissipation devices ・ Mobile phone camera flash substrates *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.