Introduction to Semiconductor-Related Equipment Development: Vacuum Lamination Equipment
A compact tabletop device that takes up little space! No bubbles will form between the wafer and the film.
The "Vacuum Adhesion Device" is a product that adheres without air bubbles between the wafer and the film by creating a vacuum inside the device. It is a compact tabletop device that does not take up much space and does not require a skilled operator. Additionally, it can be customized according to customer requests. 【Features】 ■ Tape adhesion without air bubbles between the wafer and the film ■ Adhesion method using a vacuum inside the device ■ Compact tabletop device that does not take up much space ■ No skilled operator required ■ Compatible with UV-curable film tape ■ Supports various films by changing the adhesion unit *For more details, please refer to the PDF document or feel free to contact us.
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【Customization Examples】 ■ Compatible with wafer sizes of 8 inches or smaller ■ Development test equipment for tape application and bonding for CDs and DVDs ■ Compatible with materials other than UV-curable film tape (materials that do not stretch and materials requiring specific temperatures) ■ Bonding equipment for substrates with significant unevenness or warping other than silicon wafers ■ Bonding equipment for small LCDs (12 inches or smaller) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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At Tohaki Seiko Co., Ltd., our main business is to enhance our own production technology while proposing improvements in productivity and environmental conditions to our customers, assisting them in increasing production efficiency. We aim to be a unique company by selling our original developed products born from years of experience in the design, manufacturing, and sales of labor-saving devices across various devices. Please feel free to consult us when you have any requests.