This is an introduction to diamond slurry for smoothing the surface of semiconductor package substrates.
The product smooths the surface of semiconductor package substrates. The type is POLYCRYSTALLINE DIAMOND, with a particle size of 2-4/D10 (2.3≦), D50 (3.2±0.5μm), D99 (7.5≧). Additionally, the color is transparent, and after material dispersion, it appears dark gray or black, with a viscosity of 3.6 (±0.2). 【Specifications】 ■ Viscosity (40℃): 3.6 (±0.2) ■ Powder: 0.25% or more ■ Specific gravity (23℃): 1.05–12g/cm3 ■ Flash point: 210℃ *For more details, please refer to the PDF document or feel free to contact us.
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Rat Corporation aims to be a company that satisfies its customers by leveraging its network with various electronic-related businesses both domestically and internationally to provide higher-level products and meet the diverse needs of its clients. For materials, equipment, manufacturing, and design of photomasks and printed circuit boards, trust Rat Corporation.
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