Harmony and challenge. By utilizing high-precision groove processing and finishing techniques, we accommodate various wafer shapes.
We would like to introduce our "Notch Wheel." This product minimizes processing damage through a uniform fine abrasive layer structure and employs a bond with high wear resistance and abrasive retention. It achieves long life with high shape retention. Thanks to high-precision groove processing and finishing technology, it accommodates various wafer shapes. [Features] - Minimizes processing damage and achieves wear resistance through a uniform fine abrasive layer structure - Employs a bond with high abrasive retention - Achieves long life with high shape retention - Accommodates various wafer shapes through high-precision groove processing and finishing technology *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications and Dimensions】 ■Abrasive: SD ■Grain Size: #800 to #2000 ■Concentration: 75 to 150 ■Bonding Material: MNK018・MNK016 ■Examples of Workpieces: Silicon, SIC, Sapphire *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ Silicon wafers, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Adamas Corporation manufactures and sells industrial diamond grinding wheels. Since its establishment, we have earned the trust of our customers by aiming for high quality, short delivery times, and low costs. We will continue to focus on each product to ensure customer satisfaction.