Our company has processing equipment (line) in a clean room (Class 10,000)! We can provide contract processing services such as bumping services and cleaning services!
We would like to introduce the "Solder Bumping Service" offered by Guden Machinery Co., Ltd. We are equipped with a dedicated solder paste printing machine (TD-4422) and a bump flattening device (TD-2011) specifically designed for bumping, all within a dedicated clean room. We provide pre-solder processing services supported by the high technical capabilities of our product development group. Using solder paste allows for low costs, and since it is not plated, we can achieve short delivery times. Additionally, we can accommodate narrow pitches of 120μm. We have over 10 years of experience in solder bumping (SOP) for the following applications: - Graphic memory - Automotive microcontrollers - Analog devices - Data storage memory 【Features】 ■ Solder bumps formed by paste printing ■ Low cost using solder paste ■ Short delivery times as it is not plated ■ Accommodates narrow pitches of 120μm * For more details, please refer to the PDF document or feel free to contact us. Evaluation demos in a clean room (Class 10,000) are also available. Please do not hesitate to reach out.
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【Process Flow】 1. Solder paste printing ↓ 2. Reflow ↓ 3. Flux cleaning ↓ 4. Flattening *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our business consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. Our strength lies in providing one-stop services from assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to unit assembly and repair services for touch panels and display products. Additionally, we are capable of producing products certified under ISO9001, ISO14001, as well as ISO13485 for medical devices and UL standards. On the other hand, in the semiconductor related business, we have solved many customer challenges with our advanced printing technology and know-how. We are developing a business model where our main SMT related business and semiconductor related business are supported by the product development business from both software and hardware perspectives.