Industry standard products in the CMP process of device wafers.
We handle industry-standard urethane pads for device CMP. Based on special polyurethane materials, the unique structure with highly uniform micro-foaming effectively retains slurry while evenly distributing it to the workpiece, demonstrating excellent processing uniformity. Additionally, it achieves high step reduction performance and low scratch performance. 【Product Lineup】 ■ Suitable for high flattening of various substrates - IC1000(TM) single-layer pad ■ Suitable for oxide film CMP and metal CMP - IC1000(TM) SUBA(TM) laminated pad - IC1400(TM) laminated pad ■ VISIONPAD(TM) Next-generation product of IC1000(TM) - VISIONPAD(TM) 6000N laminated pad *For more details, please download the PDF or feel free to contact us.
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【Applications】 ■ Interlayer insulating films for device wafers, CMP for metal wiring, polishing of compound substrates such as GaN and SiC. *For more details, please download the PDF or feel free to contact us.*
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For more details, please download the PDF or feel free to contact us.
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At Anchor Tech Co., Ltd., we offer a wide range of proposals that meet our customers' needs, including CMP/polishing pads with an extremely high track record both domestically and internationally, such as IC1000 and SUBA, as well as CMP/polishing slurries, work holding materials (templates/backing materials), conditioners, and more. Additionally, we provide sales and rentals of measurement equipment such as particle counters, TOC meters, pressure distribution measurement devices, and rapid microbial testing kits, so please feel free to contact us if you have any requests.