We can flexibly accommodate shapes and sizes that cannot be achieved with automatic polishing.
Our cross-sectional observation aims to examine solder joints of components such as BGA and connectors mounted on the substrate, as well as through-holes in the substrate, and to report on their condition. We accept the preparation of cross-sections of samples. We propose suitable polishing methods based on the type, structure, and materials of the target components and carry out the observations. Additionally, to improve polishing accuracy, we have a wide range of polishing materials available. By performing rough cutting to mirror finishing manually by our operators, we can flexibly accommodate various shapes and sizes. 【Workflow】 1. Receipt of samples 2. Internal meeting 3. Preliminary preparations 4. Polishing and observation 5. Result report *For more details, please download the PDF or feel free to contact us.
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【Various Materials】 ■Sandpaper: Waterproof #80 to #3000 ■Polishing Cloth: 3 types in 5 variations - natural silk, non-woven fabric, and non-woven suede ■Abrasives: 3 types of diamond slurry and 3 types of alumina slurry *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Our company conducts reliability testing and cross-section polishing and observation of printed circuit boards, providing services that meet customer needs with better quality and speed at reasonable prices. Additionally, we offer technical know-how, advice, and consulting to companies that wish to establish their own SMT reliability testing and cross-section polishing and observation techniques. Please feel free to contact us if you have any requests.