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  6. What is embossed carrier tape?

What is embossed carrier tape?

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last updated:Nov 28, 2023

金津技研
金津技研
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An embossed pocket is continuously formed on a tape-like resin sheet!

"Embossed carrier tape" is a tape-like packaging material used to store and transport semiconductor and electronic components individually in a loose state. The tape consists of a resin sheet with continuously formed embossed pockets, and there are also paper-based carrier tapes. Various types of resin sheets are used, including the commonly used transparent general PS sheet, conductive PS made by mixing conductive fillers like carbon black into PS material, and anti-static PS that has undergone static electricity treatment through coating on PS sheets. *Kanazuki Giken manufactures and sells embossed carrier tapes. *For product details or inquiries, please feel free to contact us or download the PDF materials.

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What is embossed carrier tape?

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2020-11-05_16h47_45.png
  • Related Link - http://kanazu-g.com/?page_id=9

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【Features】 ■ An embossed pocket is continuously formed on a tape-like resin sheet. ■ Used as a method to supply components to the mounting machine when users mount parts onto electronic boards. ■ There are also paper carrier tapes based on paper. ■ Various types of resin sheets are used. *For more details, please refer to the PDF document or feel free to contact us.

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Packaging material "Embossed Carrier Tape"

Packaging material "Embossed Carrier Tape"

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金津技研

金津技研

Electronic Components and Semiconductors

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Our company offers a wide range of surface mount components, from rectangular chip components to irregularly shaped parts, and can accommodate customer needs from large to small lots. To meet various conditions such as tape material, pocket shape, and required quantity, we have prepared several types of molding machines. We are also fully equipped to handle longer tape lengths. We can provide taping services for various surface mount components, leveraging over 20 years of experience in taping processing production technology.

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