[Example of Processing Technology] Sharp Angle Beveled CAP for Crystal, SAW, and Sensors
Ni and Au plating available! The tapered shape minimizes the inner radius.
The "CAP," formed in a tapered shape to shift the hollow part of the ceramic package towards the lid side, can secure a larger internal volume by adopting an acute angle shape. By transitioning from a multilayer to a single layer, it is possible to reduce package costs. The tapered shape allows for minimizing the inner radius. Additionally, it is effective for ultra-small types below 1210 type, allowing for a cavity on the metal side. 【Processing Technology Examples】 ■ Possible to reduce package costs (multilayer ⇒ single layer) ■ Possible to minimize the inner radius with a tapered shape ■ Compact package size ■ Secure adhesive area ■ Compatible with Ni and Au plating *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Other Examples of Processing Technologies】 ■ It is possible to have a cavity on the metal side, which is effective for ultra-small types such as 1210 type and below. ■ The flange-less type can secure a larger adhesive area, allowing for increased welding strength. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■ For crystal, SAW, and sensors *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Since its founding in 1920, Yoshikawa Industries has been advancing its management based on the principles of respect, trust, and love, with a belief in the spirit of "respect for humanity." Building on the foundational technologies developed in the steel-related fields, such as safety, production management, and quality control, we continue to challenge new technologies with a spirit of daily improvement and creativity. We have expanded our diversified management into areas such as engineering, electronics, system engineering, and new materials, steadily accumulating results. The Yoshikawa High Precision Kimitsu Plant specializes in precision press processing within our electronics division, one of our business areas. This plant began operations in 1988 with the precision press and mold business. Based on the knowledge and technology cultivated there, we now supply domestic and international companies as a manufacturer of pressed components for applications in electronic parts, electronic devices, home appliances, and automotive parts. In particular, we have achieved the world's No. 1 market share for LIDs used in quartz and SAW devices for mobile phones.