The uniform thickness achieved through the stamping process fully satisfies the design specifications for inner and outer dimensions!
The "plug case" of the next-generation connector standard "USB type-C" is being processed through progressive die forming. Mass production is possible through progressive die forming. The uniform thickness achieved through the forming process sufficiently meets the design specifications for inner and outer dimensions. Additionally, surface condition control is possible through barrel processing, and we can accommodate requests for single-stage and double-stage forming. 【Processing Technology Examples】 ■ Successful mass production ■ Mass production possible through progressive die forming ■ Accommodating requests for single-stage/double-stage forming ■ Hole drilling on the sides is possible ■ Materials: SUS304L/SUS316L *Other materials available upon consultation *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Other Examples of Processing Techniques】 ■ Uniform wall thickness achieved through drawing processing, fully satisfying the design standard values for inner and outer dimensions. ■ Surface condition can be controlled through barrel processing (non-textured, glossy finish). *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■For USB Type-C *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Since its founding in 1920, Yoshikawa Industries has been advancing its management based on the principles of respect, trust, and love, with a belief in the spirit of "respect for humanity." Building on the foundational technologies developed in the steel-related fields, such as safety, production management, and quality control, we continue to challenge new technologies with a spirit of daily improvement and creativity. We have expanded our diversified management into areas such as engineering, electronics, system engineering, and new materials, steadily accumulating results. The Yoshikawa High Precision Kimitsu Plant specializes in precision press processing within our electronics division, one of our business areas. This plant began operations in 1988 with the precision press and mold business. Based on the knowledge and technology cultivated there, we now supply domestic and international companies as a manufacturer of pressed components for applications in electronic parts, electronic devices, home appliances, and automotive parts. In particular, we have achieved the world's No. 1 market share for LIDs used in quartz and SAW devices for mobile phones.
![[Example of Processing Technology] Case for Camera Module Actuator](https://image.mono.ipros.com/public/product/image/eca/2000563042/IPROS10493036543100812616.png?w=280&h=280)
![[2020 Edition] Navias Co., Ltd. Contest Award History](https://image.mono.ipros.com/public/product/image/935/2000681099/IPROS70667228922474175974.png?w=280&h=280)
![[Free Offer] Prevent Blade Troubles in Production Equipment! Non-Stick Thin Film Coating](https://image.mono.ipros.com/public/product/image/fde/2000612726/IPROS23915370847246220159.jpeg?w=280&h=280)
![[Free Giveaway] Non-Stick Coating | Prevent Blade Troubles in Production Equipment!](https://image.mono.ipros.com/public/product/image/a78/2000619955/IPROS37607432622075090550.jpeg?w=280&h=280)
![[Surface Treatment Case] Surface treatment that streamlines the manufacturing process of lithium-ion batteries.](https://image.mono.ipros.com/public/product/image/604/2000700111/IPROS81671406460541521470.jpeg?w=280&h=280)