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  1. Home
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  3. Manufacturing and processing machinery
  4. Mounting Machine
  5. Circuit board processing machine
  6. Router-type circuit board separator "MR2535H2"

Router-type circuit board separator "MR2535H2"

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last updated:Nov 14, 2025

名菱テクニカ 三菱電機グループ
名菱テクニカ 三菱電機グループ
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Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.

The "MR2535H2" is a device that divides multiple small and complex-shaped circuit boards using a router method. It can cut printed circuit boards with low stress, thereby reducing the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in traditional hand-breaking or pressing methods. By utilizing automation and IT technologies cultivated at Mitsubishi Electric's Nagoya Works for equipment design and manufacturing, it supports improvements in factory productivity and quality. 【Features】 ■ Cuts unnecessary parts of complex-shaped printed circuit boards after mounting using a router bit ■ Improves setup efficiency by widening the opening width of the device's access door ■ Achieves space-saving by incorporating a dust collector within the device's lower section ■ Significantly enhances productivity by increasing the movement speed of the X-Y axis (three times faster than our conventional models) ■ Allows for setting the Z-axis position for each cutting point, enabling shorter takt times ■ Supports image teaching functions for setting cutting points on various types of circuit boards *For more details, please download the PDF or contact us.

    Circuit board processing machine
基板分割機.jpg

Router-type circuit board separator "MR2535H2"

基板分割機.jpg
基板分割機.jpg
  • Related Link - http://www.mtco-web.co.jp/products/divide/router.h…
  • Special site - Product/service details - https://pr.mono.ipros.com/mtco/product/

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【Specifications (Excerpt)】 ■ Maximum size of target substrate (length × width): 250mm × 350mm, compatible with M size substrates ■ Substrate handling  ・Substrate materials: Glass epoxy (FR-4), CEM3 and other resin substrates  ・Board thickness: 0.4 to 2.0mm  ・Positioning method: Positioning by jig ■ Basic performance  ・X-Y axis positioning method: 2-axis AC servo control  ・X-Y axis movement speed: Maximum 1,200mm/s  ・Repeat positioning accuracy: ±0.01mm, etc. ■ Device dimensions (approximate): 790W × 1140D × 1670H (including touch panel, excluding indicator lights) *For more details, please download the PDF or contact us.

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Router-type circuit board cutting machine 'MR2535H2'

Router-type circuit board cutting machine 'MR2535H2'

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Offline Teaching Software MAP-RTC01

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Turntable Circuit Board Splitter "MR2535H2T"

Turntable Circuit Board Splitter "MR2535H2T"

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Inline compatible router-type board splitter

Inline compatible router-type board splitter

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Improving Productivity! Announcement of the September Web Seminar on Circuit Board Manufacturing Equipment

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【September WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in this WEB seminar using ZOOM! The seminar in September will cover the following topics. [Course] A turntable-type substrate divider that allows parallel operation with external arrangements, which is expected to improve productivity without increasing the number of operators, and the differences in productivity compared to a single table. ----▼Click here to register▼--------------------------------------------- By clicking the 'Details & Registration' button below, you can confirm the details and register! ------------------------------------------------------------------------

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Automation Support! Announcement of July WEB Seminar

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【July WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in our WEB seminar using ZOOM! The seminar in July will cover the following topic: [Course] Introduction to the "Board Cutting Machine + Robot Transport System," which can accommodate automation in-line from board supply to board cutting, palletizing onto transport trays, and tray transport, as well as automation in batch processing. ----▼ Click here to register ▼--------------------------------------------- By clicking the 'Details/Registration' button below, you can confirm the details and register! ------------------------------------------------------------------------

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Invitation to the Substrate Manufacturing Equipment Webinar

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【June WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in our WEB seminar using ZOOM! The seminar in June will cover the following course. [Course] We will introduce various cutting methods and features possible with our board splitting machine. ----▼ Click here to register▼--------------------------------------------- By clicking the "Details & Registration" button below, you can check the details and register! ------------------------------------------------------------------------

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Notice of Participation in the Total Solutions Exhibition for Electronic Devices 2025

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We will be exhibiting the actual machines of the "PCB Cutting Machine" and "PCB Marking Device" at the Total Solution Exhibition for Electronic Devices, which will be held at Tokyo Big Sight from June 4 to June 6, 2025. We look forward to your visit to the Mitsubishi Electric Corporation booth on that day. <Location> Tokyo Big Sight, East Hall 5 Inside the Mitsubishi Electric booth (Booth No. 5H-10) <Exhibition Content> "PCB Cutting Machine" We will propose the standalone type 'MR2535H2' with a built-in dust collector for space-saving, and the turntable type 'MR2535H2T' that allows parallel setup during PCB cutting, enhancing productivity. "PCB Marking Device" We will propose high-resolution printing that supports fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as compatibility with various materials.

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名菱テクニカ

名菱テクニカ 三菱電機グループ

Industrial Machinery

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Since its establishment in 1980, when it was separated from Mitsubishi Electric Nagoya Works in the facilities and materials division, our company has been a member of the Mitsubishi Electric Group. Through various contract operations, we have nurtured our manufacturing capabilities and provided products and services related to various FA and mechatronic equipment to our customers. Moving forward, we will continue to contribute to solving the challenges faced in our customers' production sites by working on improving our comprehensive capabilities in manufacturing, including skill inheritance, production innovation, and quality improvement activities. As a trusted partner to our customers, we will value communication with them and deliver products and services that meet their satisfaction.

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